1/4 XBP06V1E4MR-G transient voltage suppressor (tvs) ? ? ? ? ? limits parameter symbol test condition min. typ. max. units breakdown voltage v br i r =1ma 6.1 6.65 7.2 v leakage current i rm v rm =5.25v - - 2.5 a forward voltage v f i f =200ma - - 1.25 v inter-terminal capacity c t v r =0v, f=1mhz - 170 - pf parameter symbol ratings units peak pulse power (*1) ppk 200 w 250 power dissipation pd 750 (*2) mw junction temperature tj 150 storage temperature range ts t g - 5 5 +150 esd durability (*3)(*4) contact discharge vpp 30 kv product name package order unit XBP06V1E4MR-G * sot-25 3,000/reel four elements in sot-25 package (anode common) high esd etr2901-004 ta=25 (*1): tp=8/20 s (*2): this is a reference data taken by using the test board. (*3): test condition iec61000-4-2 standard (*4): criterion no damage to device elements 1. cathode 2. anode 3. cathode 4. cathode 5. cathode 3 2 1 4 5 top view a bsolute maximum ratings packaging information pin configuration ? electrical characteristics esd protection marking rule general description ? ? ? ? ? ? a pplications ? ? ? bp3(product number) ? ? lot number * the ?-g? suffix indicates that the products are halogen and antimony free as well as being fully rohs compliant. ta = 2 5
2/4 XBP06V1E4MR-G (1) reverse current vs. breakdown voltage ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? (2) reverse current vs. reverse voltage 0.001 0.01 0.1 1 10 100 5.0 5.5 6.0 6.5 7.0 7.5 8.0 breakdown voltagev br (v) reverse currenti r (ma) -25 75 25 ta=125 0.0001 0.001 0.01 0.1 1 10 0123456 reverse voltagev r (v) reverse currenti r (ua) ta=125 25 75 -25 (3) breakdown voltage vs. operating temperature ? ? ? ? ? ? ? ? ? ? ? ? (4) reverse current vs. operating temperature 5.0 5.5 6.0 6.5 7.0 7.5 8.0 -50 0 50 100 150 operating temperatureta () breakdown voltagev br (v) i r =1ma 0.001 0.01 0.1 1 10 -50 0 50 100 150 operating temperatureta () reverse currenti r (ua) v r =5.25v 5v (5) inter-terminal capacity vs. reverse voltage ? ? ? ? ? ? ? ? ? ? ? ? ? (6) forward current vs. forward voltage 0 50 100 150 200 250 300 350 400 0123456 reverse voltagev r (v) inter-terminal capacityct (pf) ta=25 f=1mhz 0.01 0.1 1 10 100 1000 0 0.2 0.4 0.6 0.8 1 1.2 forward voltagev f (v) forward currenti f (ma) -25 25 ta=125 75 typical performance characteristics
3/4 XBP06V1E4MR-G ? ? sot-25 power dissipation board mount (tj max = 150 ? ) ambient temperature power dissipation pd mw thermal resistance ( /w) 25 750 105 270 166.67 u??gmm power dissipation data for the sot-25 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of referenc e data taken in the described condition. 1. measurement condit ion (reference data) condition: mount on a board ambient: natural convection soldering: lead (pb) free board: dimensions 40 x 40 mm (1600 mm 2 in one side) copper (cu) traces occupy 50% of the board area in top and back faces package heat-sink is tied to the copper traces (board of sot-26 is used.) material: glass epoxy (fr-4) thickness: 1.6 mm through-hole: 4 x 0.8 diameter evaluation board (unit: mm) 2. power dissipation vs. operating temperature pd-ta? 0 100 200 300 400 500 600 700 800 25 50 75 100 125 150 ??ta S?p?pdmw pd vs. ta ambient temperature: ta ( ? ) power dissipation: pd (mw) packaging information
4/4 XBP06V1E4MR-G 1. the products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. consult us, or our representatives before use, to confirm that the informat ion in this datasheet is up to date. 2. we assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. the products in this datasheet are not devel oped, designed, or approved for use with such equipment whose failure of malfuncti on can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. please use the products listed in this datasheet within the specified ranges. should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. we assume no responsibility for damage or loss due to abnormal use. 7. all rights reserved. no part of this dat asheet may be copied or reproduced without the prior permission of torex semiconductor ltd.
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